100% material declaration data sheet hqg208 PK119 (v1.2) september 28, 2006 ma terial declaration data sheet average weight: 10.943 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.16981 1.55% silicon 7440-21-3 100.00 0.169814 die attach material 0.01531 0.14% resin trade secret 25.00 0.003828 silver 7440-22-4 75.00 0.011483 mold compound 3.24216 29.63% epoxy resin (ep) trade secret 16.00 0.518746 silica 60676-86-0 84.00 2.723414 leadframe 0.37676 3.44% copper 7440-50-8 99.25 0.373939 chromium 7440-47-3 0.30 0.001130 tin 7440-31-5 0.25 0.000942 zinc 7440-66-6 0.20 0.000754 leadframe plating 0.001560 0.01% silver 7440-22-4 100.00 0.001560 heat sink 7.08725 64.76% copper 7440-50-8 100.00 7.08725 ext. heat sink plating 0.00547 0.05% nickel 7440-02-0 100.00 0.005471 bond wire 0.01153 0.11% gold 7440-57-5 99.04 0.011417 palladium 7440-05-3 0.9500 0.000110 ext. plating 0.03346 0.31% tin 7440-31-5 100.00 0.03346 PK119 (v1.2) september 28, 2006 www.xilinx.com 1 ? 2006 xilinx, inc. all rights reserved. a ll xilinx trademarks, registered trademarks, patents, and di sclaimers are as listed a t http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. xilinx believes this environmental information to be correct, but cannot guarantee its completeness or accuracy as it is based on data received from sources outside our company.
100% material declaration data sheet ? hqg208 2 www.xilinx.com revision history the following table shows the revi sion history for this document. date revision revision 3/08/06 1.0 initial release. 7/05/06 1.1 100% material declaration. 9/28/06 1.2 updated component descriptions. PK119 (v1.2) september 28, 2006
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